Several Indian facilities have begun assembling and testing semiconductor chips that power consumer electronics, marking a growing role for the country in the global semiconductor value chain.

These operations — focused on backend assembly, testing, and packaging (OSAT) — are critical to India’s ambition of building a complete semiconductor ecosystem.

While front-end fabrication capacity remains limited, the rise of assembly and testing units demonstrates India’s ability to attract advanced manufacturing and technology investments.

The expansion of OSAT operations will create high-skill jobs, strengthen exports, and lay the groundwork for deeper semiconductor manufacturing capabilities in the coming decade.