The Union Cabinet has cleared semiconductor fabrication and packaging projects worth Rs 4,600 crore in Odisha, Punjab, and Andhra Pradesh under the India Semiconductor Mission. 

The initiatives aim to position India as a global hub for electronics manufacturing by building capacity in chip design, fabrication, and assembly, testing, marking, and packaging (ATMP). 

With the global semiconductor market projected to reach $1 trillion by 2030, these projects will not only strengthen supply chain resilience but also attract ancillary industries and skilled talent. 

The government has committed fiscal support under the Modified Programme for Semiconductors and Display Fab Ecosystem.