RRP Electronics Ltd. has signed four significant Memorandums of Understanding (MoUs) at the Semicon India 2025 conference, reinforcing its role in India’s semiconductor ecosystem. 

As Maharashtra's first Outsourced Semiconductor Assembly and Test (OSAT) company, RRP's partnerships focus on key areas including research, security, education, and advanced packaging.

The MoUs include collaborations with:

* Tata Institute of Fundamental Research (TIFR) for high-end semiconductor applications, including the High Granularity Calorimeter (HGCAL) project for CERN.

* Rajarambapu Institute of Technology (RIT) to bridge the industry's talent gap through curriculum alignment.

* MONK9 Tech Pvt Ltd for advanced packaging technology and infrastructure support.

These agreements are expected to generate cumulative revenues starting at ₹15 crore and accelerate skill development in the semiconductor sector.