Tata Electronics is set to commence chip packaging operations at its OSAT facility in Assam in 2026, marking a major milestone in India’s semiconductor ambitions.

The facility will focus on outsourced semiconductor assembly and testing operations, a critical segment in the global chip manufacturing value chain.

India has been aggressively promoting semiconductor and electronics manufacturing through policy incentives and infrastructure support.

The project is expected to create high-skilled employment opportunities while strengthening domestic semiconductor capabilities.

It also reflects growing momentum in India’s efforts to build an indigenous semiconductor ecosystem