The foundation stone has been laid for India’s first 3D semiconductor chip packaging unit in Bhubaneswar, marking a significant advancement in the country’s semiconductor value chain.
The facility will focus on advanced packaging technologies critical for next-generation electronics.
Such capabilities are essential for moving up the semiconductor manufacturing value chain.
The project reinforces India’s ambition to build a comprehensive semiconductor ecosystem.

Company : Bhubaneswar Municipal Corporation

---

Recent News

◉ Cabinet approves Rs. 24,815 crore railway projects for UP and Andhra Pradesh - Apr 20,2026
◉ JSW Infrastructure commissions Arakkonam cargo terminal - Apr 20,2026
◉ India’s first 3D chip packaging unit foundation laid in Bhubaneswar - Apr 20,2026
◉ Lemon Tree signs new hotel near Ekta Nagar - Apr 20,2026
◉ Tamil Nadu plans air freight village near Parandur airport - Apr 20,2026
◉ Andritz to supply equipment for Torrent Power’s 3 GW pumped storage project - Apr 17,2026
◉ L&T dispatches 7th 700 MWe steam generator to NPCIL - Apr 17,2026